Logitech PM5

Precision lapping and polishing of crystalline wafers.

 

Manufacturer:  Logitech, United Kingdom
Year:  2006
Location:  231

 
Main features:  
Microprocessor control  
Precision jig for wafer flatness and alignment control  
Different lapping and polishing pads (cast iron, polyurethane)  
Precision thickness measurement gauge  
Optical autocollimator for precision  
    parallel specimen production  
Wafer diameter:  up to 83 mm
Disk diameter:  300 mm
Al2O3 abrasives:  3 µm and 9 µm
SiO2 suspension for mechano-chemical  
    fine polishing for sub-nm surface roughness  
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