Precision lapping and polishing of crystalline wafers.
Manufacturer: Logitech, United Kingdom
Year: 2006
Location: 231
| Main features: | |
| Microprocessor control | |
| Precision jig for wafer flatness and alignment control | |
| Different lapping and polishing pads (cast iron, polyurethane) | |
| Precision thickness measurement gauge | |
| Optical autocollimator for precision | |
| parallel specimen production | |
| Wafer diameter: | up to 83 mm |
| Disk diameter: | 300 mm |
| Al2O3 abrasives: | 3 µm and 9 µm |
| SiO2 suspension for mechano-chemical | |
| fine polishing for sub-nm surface roughness |