Auto 500 Edwards

Deposition of metal and dielectric thin films by electron-beam evaporation and DC/RF magnetron sputtering

 
Manufacturer: BOC Edw., United Kingdom
Year: 2007
Location: 213
 
Main features:  
Wafer diameter: up to 100 mm
Materials:  
elements: Al, Cu, W, Au, Pt, Cr, Nb, Ta, Ni, Mo, C
compounds: TiN, NiCr, Si3N4
oxides: TiO2, Ta2O5, Al2O3, SiO2, In2O3-SnO2
 
Deposition of wide range of conductor, semiconductor, and dielectric materials applicable for magnetron sputtering
Plasma glow discharge wafer cleaning
   
Wafer heating: up to 300 °C
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