Oxford Instruments Plasmalab 80 Plus RIE

Plasma reactive ion etching of metals, Si and Si compounds, and dielectrics. 

Manufacturer: Oxford Instruments, United Kingdom
Year:  2007
Location:  222
 
Main features:  
Metals:  W, Nb, Ta, Mo
Si compounds:  SiO2, Si3N4
Wafer diameter:  up to 200 mm
Roughing pump productivity:  95 m3/h
Turbo molecular pump with inert gas purge:
    5 reactive gas lines with independent
    automatic mass flow control  
    reactive gas:  O2, Ar, CF4, CHF3, SF6
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