Sawatec SM180-HP250HDMS

Resist spin coating and thermal backing.

 

Manufacturer: Sawatec Solutions, Liechtenstein
Year: 2007
Location: 213

Capabilities:

Independent coater and hotplate/coolplate in one system
Spin coating of wafers with uniform resist films
    of various thickness
After-development drying and high-temperature
    processing of resist films
Soft and hard backing of resist films
    (including vacuum or N2 atmosphere)
Wafer annealing and HMDS primer deposition
Separate resist deposition and thermal processing
Wafers:  Si, GaAs, LiNbO3 and others
Maximum wafer size:  150 mm (6”)
Maximum bit size:  100 mm

The equipment is installed in the clean room (class 100) intended for contact photolithography

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