Периодическая структура
Тестовые структуры
Фотошаблон периодической структуры

Alignment of photomask with wafer and resist exposition for contact lithography.


Manufacturer: Suss MicroTec, Germany
Year: 2007
Location: 213
Contact lithography modes:  
    soft contact  
    hard contact  
    rough vacuum contact  
    vacuum contact  
    gap printing:  0—50 µm
Spatial resolution:     up to 0.6 µm
Wafers:  Si, GaAs, LiNbO3 and others
Maximum wafer size:  100 mm (4”)
Maximum bit size:  from 10 x 10 mm2

The equipment is installed in the clean room (class 100) intended for contact photolithography.