Automatic multi-step spin wafer cleaning, resist development, and resist stripping.
Manufacturer: SSE, Germany
Год выпуска: 2007
Комната: 213
| Main features: | |
| Solvent cleaning | |
| RCA SC1 (NH4OH: H2O2) and Piranha (H2SO4:H2O2) | |
| cleaning with heating: | up to 80 °C |
| Deionized ultrapure water rinsing with heating: | up to 80 °C |
| Spin drying with gaseous Nitrogen | |
| Max. spin speed: | up to 4000 rpm |
The equipment is installed in the clean room (class 100) intended for contact photolithography