Resist spin coating and thermal backing.
Manufacturer: Sawatec Solutions, Liechtenstein
Year: 2007
Location: 213
Capabilities:
| Independent coater and hotplate/coolplate in one system | |
| Spin coating of wafers with uniform resist films | |
| of various thickness | |
| After-development drying and high-temperature | |
| processing of resist films | |
| Soft and hard backing of resist films | |
| (including vacuum or N2 atmosphere) | |
| Wafer annealing and HMDS primer deposition | |
| Separate resist deposition and thermal processing | |
| Wafers: | Si, GaAs, LiNbO3 and others |
| Maximum wafer size: | 150 mm (6”) |
| Maximum bit size: | 100 mm |
The equipment is installed in the clean room (class 100) intended for contact photolithography